MSL  |  SKU: Burnin

MSL: Burn-In in Test Equipment

Reliability test chamber for powered electronic components

Clima & Thermotemperature range
from -75° C to 200° C

Characteristics
Cold Cold
Hot Hot
Capacity
From 1x150L to 4x150L
1x300L
2x300L
single

Description

Options
Customizable according to your needs:
Automatic or manual insertion and extraction system for the boards to be tested.
Possibility of stacked ovens.
Possibility to create connections from the interface board to power supplies and/or install a PC for controlling the driver board.
Cooling with refrigeration unit or water for cycle time savings.
Programming of thermal cycles with I/O customizable according to customer requirements.
Customization of interface, BIB, and drivers.

Features

Characteristics
Equipment designed to perform stress tests on electronic components, subjecting them to high temperatures, operating voltages, and power on/off cycles. The goal is to identify early failures and improve the long-term reliability of the devices. MSL is responsible for providing the oven and interfacing between the test board and the control board (located outside the oven).
Advanced control with high-performance PLC with PID regulation.
Remotable graphical interface on PC or mobile device.
Flexible communication: Modbus TCP standard, OPC UA, EtherCAT, and SQL.
Secs-Gem Comunication to interface Host server with equipment HSMS comunication.
Remote assistance with Ethernet or mobile connection, using a smartphone connected with USB.
Data and alarm management with a dedicated FTP server for log saving.
Automatic door closure.

Manuals

datasheet